The biggest issue in the mobile phone market is 5G network.
The interior and exterior material which is developing and manufacturing in Korea Clad Tech can be solved various problem of mobil phone industry.
STS/CU/STS alternative item to replace existing C19400 or 304+Graphite film for Rear plate of mobile phone interior is attracting extraordinary attention.
Application | TYPE | Components and Materials | SIZE (mm) | Properties | ||
---|---|---|---|---|---|---|
Thickness | Width | |||||
Real Plate(방열판) | STS/Cu/STS | Clad material | STS 304, 316 ETC. | 0.1~1.0 | ≥500 | Material thickness andratio can be modified todevelop as customer needs. |
Base Metal | C1020, C1100, ETC. | Clad Metal | STS 304, 316 ETC. | |||
Case Accessary | STS/Al | Clad material | Al 1050/3003/6013 ETC. | 0.4~2.0 | ≥500 | |
Base Metal | STS 304,316 ETC. | |||||
Ti/Al | Clad material | Al 1050/3003/6013 ETC. | 0.4~2.0 | ≥500 | ||
Clad material | Ti gr 1,2 ETC. | |||||
Cu/STS | Clad material | C1020, C1100, ETC. | 0.4~6.0 | ≥500 | ||
Clad material | STS 304,316 ETC. | |||||
Shield Cap Lid | Cu/STS/Cu | Clad material | C1020, C1100, ETC. | 0.1~1.0 | ≥500 | |
Base Metal | STS 304,316 ETC. | |||||
Clad Metarial | C1020, C1100, ETC |